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TDA8170
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
. . . .
The functions incorporated are : POWER AMPLIFIER FLYBACK GENERATOR REFERENCE VOLTAGE THERMAL PROTECTION DESCRIPTION The TDA8170 is a monolithic integrated circuit in HEPTAWATTTM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Colour and B & W television receivers as well as in monitors and displays. PIN CONNECTIONS
7 6 5 4 3 2 1 Tab connected to Pin 4 REFERENCE VOLTAGE AND NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK GENERATOR SUPPLY VOLTAGE INVERTING INPUT
HEPTAWATT (Plastic Package) ORDER CODE : TDA8170
BLOCK DIAGRAM
+ VS
2
6
3
FLYBACK GENERATOR RE FERENCE VOLTAGE
1
PO WER AMPLIFIER
5
THERMAL P ROTECTION
TDA8170
4
YOKE
7
December 1997
1/7
8170-02.EPS
8170-01.EPS
TDA8170
SCHEMATIC DIAGRAM
5 2 D4 Q11 C1 Q10 7 Q7 1 Q1 Q2 Q4 D1 R6 Q5 Q3 Q16 R1 D2 Q19 R2 R3 R7 R8 R9 Q14 Q15 Q17 Q22 Q18 R11 Q6 D6 Q8 Q9 D7 Q13 D3 R4 D5 R5 D8 Q20 Q21 3 D9 Q12 R10 6
C2 R12 Q24 Z1 Q25 R13 R14 Q27 Q28 Q29 R15 4 R19 R16 R17 R18
8170-03.EPS
Q23
Q26 Z2
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TDA8170
ABSOLUTE MAXIMUM RATINGS
Symbol VS V5, V6 V3 V1, V7 Io Io Io I3 I3 Ptot Tstg, Tj Supply Voltage (pin 2) Flyback Peak Voltage Voltage at Pin 3 Amplifier Input Voltage Output Peak Current (non repetitive, t = 2 msec) Output Peak Current at f = 50 or 60 Hz, t 10 sec Output Peak Current at f = 50 or 60 Hz, t > 10 sec Pin 3 DC Current at V5 < V2 Pin 3 Peak to Peak Flyback Current at f= 50 or 60 Hz, tfly 1.5msec Total Power Dissipation at Tcase = 90 C Storage and Junction Temperature Parameter Value 35 60 + Vs + Vs, - 0.5 2.5 3 2 100 3 20 - 40, +150 V A A A mA W C
8170-01.TBL
Unit V V
A
THERMAL DATA
Symbol R th j-case Parameter Thermal Resistance Junction-case Max. Value 3 Unit C/W
8170-02.TBL 8170-03.TBL
ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25oC unless otherwise specified)
Symbol I2 I6 I1 V7 V7 VS V3L V5 V5L V5H Tj Parameter Pin 2 Quiescent Current Pin 6 Quiescent Current Amplifier Input Bias Current Reference Voltage Reference Voltage Drift versus Supply Voltage Pin 3 Saturation Voltage to GND Quiescent Output Voltage Output Saturation Voltage to GND Output Saturation Voltage to Supply Junction Temperature for Thermal Shut Down Vs = 15 to 30 V I3 = 20 mA Vs = 35 V , R a = 39 k Vs = 15 V , R a = 13 k I5 = 1.2 A I5 = 0.7 A - I5 = 1.2 A - I5 = 0.7 A Test Conditions I3 = 0, I5 = 0 I3 = 0, I5 = 0 V1 = 1 V Min. Typ. Max. 8 16 - 0.1 2.2 1 1 18 7.5 1 0.7 1.6 1.3 140 1.4 1 2.2 1.8 2 16 36 -1 Unit mA mA A V mV/V V V V V V V V C Fig. 1a 1a 1a 1a 1a 1c 1d 1d 1c 1c 1b 1b
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TDA8170
Figure 1a : Measurement of I1, I2, I6, V7, V7/VS
+VS I2 2 6 5 10k S1 1 7 V7 4 b I1 1V
8170-04.EPS
Figure 1b : Measurement of V5H
I6
+VS 2 6 V5H 1 1V
TDA8170
TDA8170
5
a
4
-I5
8170-05.EPS
S1 : (a) I2 and I6 ; (b) I1
Figure 1c : Measurement of V3L, V5L
+VS I3 or I5 2 6 3 b 1 3V 5 4
8170-06.EPS
Figure 1d : Measurement of V5
+VS 2 6
S1
12k
a
2V
1
TDA8170
5
TDA8170
4 Ra
V5
S1 : (a) V3L ; (b) V5L
Figure 2 :
Application Schematic
1N4001 VS C1 0.1F 2 C7 1F 7
Vi
C2 470F
D1
C3 220F 6 3
tfly
V7
Iy
TDA8170
R1
5 C4 0.22F
Ly 24.6mH
to
GND
1
10k
to
RT1
4
4.7k
R7 1.5 R4 C6 4.7F
8.2k
R6 330
R3 IN
12k
Ry 9.6
R2 5.6k
C5 2200F R5 Iy
8170-08.EPS
R5 1
to
4/7
8170-07.EPS
V3L
V5L
5.6k
TDA8170
Figure 3 : PC Board and Component layout of the Circuit of fig. 2(1 : 1 scale)
TDA8170
C1 D1 C2 C5 R1 R7 R3 R4 R6 C3
C6 R11
R5
R2
GND
VS
YOKE YOKE GND ( VO )
V7
IN
COMPONENTS LIST FOR TYPICAL APPLICATIONS
Component RT1 R1 R2 R3 R4 R5 R6 R7 D1 C1 C2 eI. C3 eI. C4 C5 eI. C6 eI. C7 110 TVC 5.9 /10 mH 1.95 App 10 12 10 27 12 0.82 270 1.5 1N 4001 0.1 1000/25 V 220/25 V 0.22 200/25 V 4.7/16 V 1.0/16V 110 TVC 9.6 /24.6 mH 1.2 App 4.7 10 5.6 12 8.2 1 330 1.5 1N 4001 0.1 470/25 V 220/25 V 0.22 2200/25 V 4.7/16 V 1.0/16V 90 TVC 15 /30 mH 0.82 App 10 12 5.6 18 5.6 1 330 1.5 1N 4001 0.1 470/25 V 220/25 V 0.22 1000/16 V 10/16 V 1.0/16V Unit k k k k k - F F F F F F
8170-04.TBL
F
5/7
8170-09.EPS
TDA8170
TYPICAL PERFORMANCES
Parameter Vs - Supply Voltage Is - Current tfly - Flyback Time Ptot - Power Dissip. R th o-a - Heatsink Tamb Tj max To VI V7 110 TVC 5.9 /10 mH 24 280 0.6 4.2 7 60 110 20 2.5 2.5 110 TVC 9.6 /27 mH 22.5 175 1 2.5 13 60 110 20 2.5 2.5 90 TVC 15 /30 mH 25 125 0.7 2.05 16 60 110 20 2.5 2.5 Unit V mA ms W C/W C C Vpp Vp
8170-05.TBL 8170-10.EPS
ms
MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the HEPTAWATTTM package attaching the heatsink is very simple, a screw a compression Figure 4 : Mounting Examples spring (clip) being sufficient. Between the heatsink and the packageit isbetter to insert a layerof silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces.
6/7
TDA8170
PACKAGE MECHANICAL DATA : 7 PINS - PLASTIC HEPTAWATT
Dimensions A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia.
Min.
Millimeters Typ.
2.4 1.2 0.35 0.6 2.41 4.91 7.49 10.05 16.97 14.92 21.54 22.62 2.6 15.1 6 2.8 5.08 3.65 2.54 5.08 7.62
Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4
Min.
Inches Typ.
0.094 0.047 0.014 0.024 0.095 0.193 0.295 0.396 0.668 0.587 0.848 0.891 0.100 0.200 0.300
Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409
3 15.8 6.6
0.102 0.594 0.236 0.110 0.200
0.118 0.622 0.260
HEPTV.TBL
3.85
0.144
0.152
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This pu blication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1997 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips 2 2 I C Patent. Rights to use these components in a I C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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PM-HEPTV.EPS

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